121. Quality hand soldering and circuit board repair
Author: Smith, H. Ted
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Printed circuits-- Maintenance and repair,، Solder and soldering
Classification :
TK
7868
.
P7
.
S568
2001
122. RELIABILITY STUDIES OF Pb-FREE SOLDER JOINTS DOWN TO 1 μm IN DIAMETER
Author: Liu, Yingxia
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject:
123. Reflow soldering processes :
Author: Ning-Cheng Lee.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic apparatus and appliances -- Design and construction.,Electronic packaging.,Solder and soldering.
Classification :
TK7836
.
N564
2002
124. Reflow soldering processes :SMT, BGA, CSP and flip chip technologies. ]CD[
Author: Lee, Ning-Cheng., Ning-Cheng Lee
Library: Library and Documentation Center of Kurdistan University (Kurdistan)
Subject: Design and construction ، Electronic apparatus and appliances,، Solder and soldering,، Electronic packaging,، Electric connectors
Classification :
TK7836
.
L43
2002
125. Reliability of RoHS-Compliant 2D and 3D IC interconnects
Author: John Lau
Library: Library of Urmia University of Technology (West Azarbaijan)
Subject: Interconnects (Integrated circuit technology), Reliability,Green technology, Reliability,TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics, bisacsh
Classification :
TK
,
7874
.
53
,.
L38
,
2011
126. SMT soldering handbook
Author: / Rudolf Strauss
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Solder and soldering , Handbooks, manuals, etc,Surface mount technology,Printed circuits , Design and construction
Classification :
E-BOOK
127. Solder Joint Reliability Assessment
Author: / Mohd N. Tamin, Norhashimah M. Shaffiar
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: TESTING& CONTROL SYSTEMS|ENGINEERING, CIVIL|ENGINEERING, MECHANICAL|ENGINEERING, MULTIDISCIPLINARY|MATERIALS SCIENCE, CHARACTERIZATION &AUTOMATION
Classification :
E-BOOK
128. Solder and soldering
Author: / Howard H. Manko
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Solder and soldering
Classification :
TT
267
.
M26
1979
129. Solder joint reliability
Author: / edited by John H. Lau
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
130. Solder joint reliability
Author: / edited by John H. Lau
Library: Tehran University, technical faculty libraries 1 (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
131. Solder joint reliability
Author: / edited by John H. Lau
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
132. Solder joint technology. materials, properties, and Reliability
Author: Tu, K. N.)King-ning(
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Welded joints,، Welded joints- Reliability,، Solder and soldering,، Metals- Weldability
Classification :
TA
492
.
W4
T83
2007
133. Solder paste in electronics packaging
Author: / Jennie S.Hwang,Hwang
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Printed circuits -- Design and construction,Solder pastes,surfacemount technology
Classification :
TK
7868
.
P7H82
1989
134. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
Author: Hwang, Jennie S.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Design and construction ، Printed circuits,، Solder pastes,، Surface mount technology
Classification :
TK
7868
.
P7
H82
1989
135. Solder paste in electronics packaging :technology and applications in surface mount, hybrid circuits, and component assembly
Author: Jennie S. Hwang
Library: Central Library and Information Center of Shahed University (Tehran)
Subject: Printed circuits--Design and construction,Solder pastes,Surface mount technology
Classification :
TK
،
7868
،.
P7
,
H82
،
1989
136. Soldering
Author: Thwaites, C. J.)Colin John(
Library: Central Library and Documentation Center (Kerman)
Subject: ، Solder and soldering
Classification :
TT
267
.
T63
1975
137. Soldering :
Author: edited by Mel Schwartz.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Solder and soldering.
Classification :
TS610
.
S653
2014eb
138. Soldering
Author:
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Solder and soldering,Soldering
Classification :
TS610
.
S65
2014
139. Soldering and brazing
Author: Cain, Tubal
Library: Central Library of Sharif University of Technology (Tehran)
Subject: Handbooks, manuals, etc ، Solder and soldering,Handbooks, manuals, etc ، Brazing
Classification :
TS
610
.
C3
1985
140. Soldering and brazing /
Author: Tubal Cain.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Brazing.,Solder and soldering.
